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UV LED curing machine for wafer film debonding

Futansi produces and develops UV LED wafer decoupling machine, which uses imported LED lamp beads and has the advantages of high energy, uniform light and stable light source. The equipment adopts touch screen control mode with adjustable power (10%-100%) and free setting of irradiation time. The equipment is small in size, covers an area of less, is easy to install, and can be used in conjunction with the assembly line workshop.
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Product Details

UV LED curing machines play an important role in the semiconductor industry, especially in wafer film debonding applications. This equipment provides an efficient and precise curing method for a wide range of sensitive materials.


Futansi produces and develops UV LED wafer decoupling machine, which uses imported LED lamp beads and has the advantages of high energy, uniform light and stable light source. The equipment adopts touch screen control mode with adjustable power (10%-100%) and free setting of irradiation time. The equipment is small in size, covers an area of less, is easy to install, and can be used in conjunction with the assembly line workshop.

 

Application areas:
- Futansi UV LED decoupling machine is a kind of equipment for wafer chip UV cutting film strip surface curing, widely used in wafer packaging industry, such as ceramic cutting, glass processing and other processes of UV decoupling.
- Optical communication industry, photovoltaic new energy, semiconductor materials, medical devices, 3C electronics, PCB circuit boards, optical components, liquid crystal display and laboratory materials.

 

Advantages:
1. imported LED lamp beads, with high energy, strong light and long life and other advantages.
2. single band LED UV light source, common wavelengths are 365nm, 385nm, 395nm, 405nm, no heat radiation.
3. UV LED curing light source without heat radiation, irradiation of the surface temperature of the substrate rises no more than 5 ℃, suitable for heat-sensitive materials surface drying.
4. multi-channel working mode, according to the actual use of the choice of 1-4 irradiation head alone or synchronous work.
5. low power consumption, through the LED chip will be converted into light energy, energy loss is small, power consumption of about one-tenth of the traditional UV mercury lamp.
6. Clean and environmentally friendly without pollution.

 

4 Inches 6 Inches 8 Inches 10 Inches 12 Inches Lab Debonding Machine UV Curing System


This wafer decoupling UV curing system is suitable for optical lenses, LED integrated chips, UV films, and more.

It offers an easy-to-operate interface for laboratory cell research and provides video shipment inspection and mechanical test reports. The core components of the unit include PLC, motor, and pump, and it comes with a one-year warranty on core components.

 

The advantage of these UV LED curing machines is their ability to provide efficient curing without generating excessive heat, which is especially important for temperature-sensitive applications in the semiconductor industry. By using UV LED technology, the curing process can be precisely controlled while reducing energy consumption and increasing productivity.

 

Outline Dimensions

LED Head Lamp

UV curing machine

 

 

Note: The controller package comes with a 2-meter interconnect cable for linking the controller and emitter. For longer distances, an additional interconnect cable can be purchased to extend the range without compromising performance.

 

Resources

 

    350mm*350mm UV LED Flood curing system

    UV LED curing system broshure

    Futansi UV LED system User Manual

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